Focused on the design of open, high-performance AI all-in-one cabinets, this program provides open standards-based reference specifications for future-oriented SuperPODs with high power and high-speed interconnection. It currently comprises three projects: power supply, thermal management, and high-speed interconnection. Power Supply, Thermal Management, High-Speed Interconnection
Starting from the hardware reference design specifications for AI all-in-one cabinets for SuperPOD and cluster applications, it will successively establish working groups for power supply, thermal management (liquid cooling), high-speed interconnection and nodes, standardize the interaction interfaces of the subsystems of AI all-in-one cabinets, and introduce and continuously evolve cutting-edge technologies in relevant fields according to future application needs.
Power Supply, Thermal Management, High-Speed Interconnection, Cabinet, Server & Node, …
| Document Name | Version | Status | Release Date | Operation |
|---|---|---|---|---|
| Research Report on 800 V DC Power Supply Architecture for Megawatt-Level Computing Systems (AI All-in-One Cabinet) | 0.5 | Released | 2026-07-02 | Log in to Download |
| GCC Liquid-Cooled Rack Interface Specification | 1.0 | Released | 2026-07-01 | Log in to Download |
| Liquid-Cooled Rack System Architecture Design Specifications - Type A | 1.0 | Released | 2026-07-01 | Log in to Download |
