Six programs covering the full-stack AI infrastructure, from AI all-in-one cabinets to green computing power
All practices of the Open AI Infra Community are reflected in the actual operations of its programs and projects, covering the development of specifications, designs, standards, and research reports for DC facilities, cabinets, power supply and distribution, liquid cooling, integrated systems, system interconnection, boards, components, and performance benchmarks. It also encompasses industry activities such as testing and certification, exhibitions, talent development, and industry initiatives.
Focused on the design of open, high-performance AI all-in-one cabinets, this program provides open standards-based reference specifications for future-oriented SuperPODs with high power and high-speed interconnection. It currently comprises three projects: power supply, thermal management, and high-speed interconnection. Power Supply, Thermal Management, High-Speed Interconnection
Focused on key fields such as liquid cooling, power supply and distribution, DC intelligence, and facility construction in high-density computing environments, this program develops forward-looking technical specifications and standards. It currently comprises three projects: power supply, liquid cooling, and DC intelligence. Power Supply, Liquid Cooling, DC Intelligence
Focused on the deep optimization and standardization of core server hardware components, this program aims to build an efficient, flexible, and scalable next-generation computing foundation. It currently comprises the DPU project. DPU Project
| Project Name | Project Group | Version | Status | Release Date | Operation |
|---|---|---|---|---|---|
| Technical Specification for AIDC Air Cooling Terminal Equipment | DC Infrastructure | 1.0 | Released | 2026-10-10 | View & Download |
| GCC-OAII AIDC Certification Evaluation Form | DC Infrastructure | 1.0 | Released | 2026-10-09 | Log in to Download |
| OPEN NPO项目运行管理规定 | AI Rack | 1.0 | Released | 2026-10-08 | Log in to Download |
| Secondary-side Piping Process Specification | DC Infrastructure | 1.0 | Released | 2026-08-26 | Log in to Download |
| Technical Specification for Intelligent O&M of Cold Plate Liquid Cooling System | DC Infrastructure | 1.0 | Released | 2026-08-18 | Log in to Download |
| CDU Key Specifications and Evolution Roadmap | DC Infrastructure | 1.0 | Released | 2026-07-03 | Log in to Download |
| Research Report on 800 V DC Power Supply and Distribution for GW-Level DCs | DC Infrastructure | 0.5 | Released | 2026-07-02 | Log in to Download |
| Design, Evolution, and Deployment Specifications for High-Density Smart Module Power Distribution Systems | DC Infrastructure | 0.8 | Released | 2026-07-02 | Log in to Download |
| Research Report on 800 V DC Power Supply Architecture for Megawatt-Level Computing Systems (AI All-in-One Cabinet) | AI Rack | 0.5 | Released | 2026-07-02 | Log in to Download |
| GCC Liquid-Cooled Rack Interface Specification | AI Rack | 1.0 | Released | 2026-07-01 | Log in to Download |
| AIDC Infrastructure Specification | DC Infrastructure | 1.0 | Released | 2026-07-01 | Log in to Download |
| Liquid-Cooled Rack System Architecture Design Specifications - Type A | AI Rack | 1.0 | Released | 2026-07-01 | Log in to Download |
| GW级AIDC-液冷补冷-磁悬浮冷源应用研究报告 | DC Infrastructure | — | 编制中 | — | No file available |
| Liquid-cooled Quick Connector for Polymer Materials | AI Rack | — | 编制中 | — | No file available |
| Integrated Architecture and Protocol Specifications for Cloud-Edge-Device Data of Power and Environment Monitoring | DC Infrastructure | — | 编制中 | — | No file available |
