Six programs covering the full-stack AI infrastructure, from AI all-in-one cabinets to green computing power
All practices of the Open AI Infra Community are reflected in the actual operations of its programs and projects, covering the development of specifications, designs, standards, and research reports for DC facilities, cabinets, power supply and distribution, liquid cooling, integrated systems, system interconnection, boards, components, and performance benchmarks. It also encompasses industry activities such as testing and certification, exhibitions, talent development, and industry initiatives.
Focused on the design of open, high-performance AI all-in-one cabinets, this program provides open standards-based reference specifications for future-oriented SuperPODs with high power and high-speed interconnection. It currently comprises three projects: power supply, thermal management, and high-speed interconnection. Power Supply, Thermal Management, High-Speed Interconnection
Focused on key fields such as liquid cooling, power supply and distribution, DC intelligence, and facility construction in high-density computing environments, this program develops forward-looking technical specifications and standards. It currently comprises three projects: power supply, liquid cooling, and DC intelligence. Power Supply, Liquid Cooling, DC Intelligence
Focused on the deep optimization and standardization of core server hardware components, this program aims to build an efficient, flexible, and scalable next-generation computing foundation. It currently comprises the DPU project. DPU Project
| Project Name | Project Group | Version | Status | Release Date | Operation |
|---|---|---|---|---|---|
| Standardized Pre-research and Ecosystem Construction of 200 kW+ per Cabinet and Phase-Change Cold Plate Architecture | DC Infrastructure | — | 编制中 | — | No file available |
| GCC DPUTechnical specifications-A型 | Board & Component | — | 编制中 | — | No file available |
| MaxXQD Technical Specification (High Current, Low Flow Resistance) | AI Rack | — | 编制中 | — | No file available |
| Mini QDTechnical specifications | AI Rack | — | 编制中 | — | No file available |
| Interoperable/Interchangeable Cold Plate System | AI Rack | — | 编制中 | — | No file available |
| AIDC智能监控系统参考设计 | DC Infrastructure | — | 编制中 | — | No file available |
| CDU通用技术规范 | DC Infrastructure | — | 编制中 | — | No file available |
| Intelligent Closed-Loop Liquid Cooling System: Online Detection - Early Warning - O&M | AI Rack | — | 编制中 | — | No file available |
| Research Report on High-Performance Cold Plate Design and Testing | AI Rack | — | 编制中 | — | No file available |
| OPEN NPOSpecifications | AI Rack | — | 编制中 | — | No file available |
| Technical Requirements and Test Methods for Two-Phase Cold Plate Liquid Cooling Systems in Computing Centers | AI Rack | — | 编制中 | — | No file available |
| 无水风液兼容冷却架构规范 | DC Infrastructure | — | 编制中 | — | No file available |
| Liquid-Cooled Rack System Architecture Design Specifications - Type A | AI Rack | — | 编制中 | — | No file available |
| Compatibility Requirements and Test Methods for Single-Phase Cold Plate Liquid Cooling Flow-Path Materials | Dual-Zero Action | — | 编制中 | — | No file available |
| 冷板式液冷冷却液技术要求和测试方法（适用于去离子水型） | Dual-Zero Action | — | 编制中 | — | No file available |
